PCB saman jiyya shine mabuɗin da tushe na ingancin facin SMT.Tsarin maganin wannan hanyar haɗin gwiwa ya ƙunshi abubuwa masu zuwa.A yau, zan raba gwaninta a cikin ƙwararrun ƙwararrun hukumar da'ira tare da ku:
(1) Sai dai ENG, ba a bayyana kauri na plating Layer a cikin daidaitattun ka'idodin PC na ƙasa ba.Ana buƙatar kawai don biyan buƙatun solderability.Babban bukatun masana'antu sune kamar haka.
OSP: 0.15 ~ 0.5 μm, ba a ƙayyade ta IPC ba.An ba da shawarar yin amfani da 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05 ~ 0.20um (PC kawai tana ƙayyadad da buƙatu mafi ƙarancin halin yanzu)
Im-Ag: 0.05 ~ 0.20um, da kauri, mafi tsanani da lalata ne (PC ba a kayyade)
Im-Sn: ≥0.08um.Dalilin da ya fi girma shine Sn da Cu za su ci gaba da haɓaka zuwa CuSn a cikin zafin jiki, wanda ke rinjayar solderability.
HASL Sn63Pb37 gabaɗaya an ƙirƙira ta ta halitta tsakanin 1 da 25um.Yana da wuya a sarrafa tsari daidai.Ba shi da gubar galibi yana amfani da gami da SnCu.Saboda tsananin zafin aiki, yana da sauƙi a samar da Cu3Sn tare da rashin ingancin sauti, kuma da kyar ake amfani dashi a halin yanzu.
(2) Rashin ruwa zuwa SAC387 (bisa ga lokacin jika a ƙarƙashin lokutan dumama daban-daban, naúrar: s).
0 sau: im-sn (2) florida tsufa (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR Zweiter Im-Sn yana da mafi kyawun juriya na lalata, amma juriyarsa ba ta da kyau!
Sau 4: ENG (3) -ImAg (4.3) -OSP (10) -ImSn (10).
(3) A wettability zuwa SAC305 (bayan wucewa ta cikin tanderun sau biyu).
ENG (5.1) - Im-Ag (4.5) - Im-Sn (1.5) - OSP (0.3).
A haƙiƙa, masu son na iya zama da ruɗani sosai tare da waɗannan sigogi na ƙwararru, amma dole ne masanan masana'antun PCB da faci su lura da shi.
Lokacin aikawa: Mayu-28-2021
